Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products
US5037691A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 1989 |
| Grant date | Aug 6, 1991 |
| Priority date | — |
| Expiry date | Aug 23, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern permitting punching out or high speed drilling of hole openings for subsequent printed circuit applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.