Silver palladium alloy
US5037708A · kind A · utility
19Cited by
3References
5Claims
0Family size
Inventor
Key dates
| Filing date | Sep 7, 1990 |
| Grant date | Aug 6, 1991 |
| Priority date | — |
| Expiry date | Sep 7, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12896
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A silver colored metal alloy having improved tarnish resistance is disclosed, which is intended primarily for solid sterling jewelry and utensils and may also be used in silver plating, and does not easily tarnish and corrode. The alloy consists essentially of 80% to 92.5% silver, 4% to 9% palladium, 0% to 10% copper and 0.5% to 1% indium or zinc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.