Field emitter structure and fabrication process
US5038070A · kind A · utility
49Cited by
4References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 1989 |
| Grant date | Aug 6, 1991 |
| Priority date | — |
| Expiry date | Dec 26, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J9/025
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plurality of field emitters in the form of hollow, upstanding pointed cones or pyramids formed by a molding process extend from a surface of an electrically conductive layer. An electrically conductive mesh is adhered to an opposite surface of the conductive layer by a high temperature brazing process in electrical connection with the conductive layer. The mesh provides a strong metal base with good thermal conductivity for mounting. Additional elements such as a gate and anode structure may be formed on the conductive layer in alignment with the field emitters to form a field emitting triode array or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.