Vapor reflow type soldering apparatus
US5038496A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 1989 |
| Grant date | Aug 13, 1991 |
| Priority date | — |
| Expiry date | Jul 26, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/015
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A vapor reflow type soldering apparatus comprises a vapor generating tank disposed substantially centrally in the apparatus for receiving therein a thermal medium and saturated vapor of said thermal medium; a preheating chamber arranged upstream of the vapor generating tank; a cooling chamber arranged downstream of the vapor generating tank; an inlet side passage connecting the vapor generating tank and the preheating chamber; an outlet side passage connecting the vapor generating tank and the cooling chamber; a conveyor extending horizontally through the preheating chamber, the inlet side passage, the vapor generating tank, the outlet side passage and the cooling chamber, wherein the conveyor can vary the width thereof; an outlet side exhaust port provided at the outlet side passage; an inlet side cooler arranged beneath the inlet side passage and having a cover at an upper position thereof; an outlet side cooler arranged beneath the outlet side passage and extending close to the outlet side exhaust port; a lower vapor discharge opening formed below the conveyor within the vapor generating tank; and a shutter connected with a movable conveyor guide and also with the peripheral par…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.