Epitaxial facility
US5038711A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 1989 |
| Grant date | Aug 13, 1991 |
| Priority date | — |
| Expiry date | Jan 5, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B35/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An epitaxial facility with at least one reaction chamber made of dielectric material, comprising a gas inlet in the ceiling area and a gas outlet in the floor area, a gas mixer connected to the gas inlet of the reaction chamber for the infeed of reaction and scavenging gases, a polyhedral support made of graphite, which is mounted so as to be able to rotate in the reaction chamber between the gas inlet and the gas outlet and tapers toward the gas inlet, for accommodating a number of wafers, and induction heating system essentially surrounding the reaction chamber for indirect heating of the wafer support. The epitaxial facility further comprises a device for transferring the wafer support from a charging zone outside of the reaction chamber to a working position inside the reaction chamber, a device for charging the wafer support with wafers in the charging zone, and a clean-air space accommodating the facility components. With the use of scavenging and reaction gases from the gas mixer through the reaction chamber when the wafer support is in the working position, and of pure air and protective gases in the clean-air space when the wafer support is in the charging zone, and betwee…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.