Amorphous, hydrogenated carbon electroactive passivation layer

US5039358A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Siegfried Birkle · Höchstadt an der Aisch, DE
• Johann Kammermaier · Unterhaching, DE
• Gerhard Schmidt · Graz, AT
• Albrecht Winnacker · Erlangen, DE

Key dates

• Filing date: Feb 1, 1990
• Grant date: Aug 13, 1991
• Expiry date: Feb 1, 2010

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/958
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention provides electroactive passivation layers for semiconductor components comprising a thin layer of amorphous, hydrogenated carbon.