Electrodeposited eutectic tin-bismuth alloy on a conductive substrate
US5039576A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 12, 1990 |
| Grant date | Aug 13, 1991 |
| Priority date | — |
| Expiry date | Apr 12, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12708
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electroplating bath, cell and method for the electrodeposition of a wide range of tin-bismuth alloys onto a conductive substrate comprises tin and bismuth ion in aqueous solution, and an alkyl sulfonic or polysulfonic acid or salt as the electrolyte. The sulfonic component is present in amounts sufficient to maintain the bismuth in solution. In the operation of the method of the invention, electroplated tin-bismuth eutectic alloys of controlled composition are obtained. The alloys of tin and bismuth contain amounts of both metals such that the plated alloy has a melting point substantially lower than that of either metal alone, and a melting point lower than that of a tin-lead alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.