Deep u.v. photoresist process utilizing compositions containing polycyclic cyclopentane 2-diazo-1,3-dione
US5039596A · kind A · utility
5Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1989 |
| Grant date | Aug 13, 1991 |
| Priority date | — |
| Expiry date | Jun 29, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07C2603/91
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
Photosensitizers containing saturated and unsaturated polycyclic compounds containing the cyclopentane-2-diazo-1,3-dione structural unit. These compounds have their maximum u.v. absorption at around 248 nm, decompose into polar products upon irradiation, and can be used as photosensitizers in positive deep u.v. or excimer laser (248 nm) lithography. They are most preferably useful with deep u.v. transparent resins for forming photoresists.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.