Thermoplastic molding compounds based on functionalized polyphenylene ethers and polyamides
US5039746A · kind A · utility
12Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1989 |
| Grant date | Aug 13, 1991 |
| Priority date | — |
| Expiry date | Feb 27, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/905
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic molding compounds are prepared from a functionalized polyphenylene ether and a polyamide. The polyphenylene ether is functionalized by the incorporation of a small quantity of a functionalized phenol monomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.