Patent · US Expired

Thermoplastic molding compounds based on functionalized polyphenylene ethers and polyamides

US5039746A · kind A · utility

12Cited by
3References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 27, 1989
Grant dateAug 13, 1991
Priority date
Expiry dateFeb 27, 2009

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S525/905
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Thermoplastic molding compounds are prepared from a functionalized polyphenylene ether and a polyamide. The polyphenylene ether is functionalized by the incorporation of a small quantity of a functionalized phenol monomer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.