High force clip
US5040096A · kind A · utility
20Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1990 |
| Grant date | Aug 13, 1991 |
| Priority date | — |
| Expiry date | Jun 7, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A clip for attaching a semiconductor to a heat sink comprises an arcuate section having a lip which contacts a projection on a heat sink so that the remainder of the arcuate section is disposed over the projection, the arcuate section also having a central stiffening rib. The clip further comprises a plate extending from the end of the arcuate section opposite its lip, the plate having sidewalls which form a semiconductor opening. When the clip is in place on the heat sink, the clip is flexed, and the plate is forced against a semiconductor, holding it in place against the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.