Non-contact polishing
US5040336A · kind A · utility
9Cited by
7References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 15, 1986 |
| Grant date | Aug 20, 1991 |
| Priority date | — |
| Expiry date | Jan 15, 2006 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A non-contact polishing apparatus is used for polishing semiconductor planar substances. The substrate is set back from any surface and is held by a chuck fixed within a collar. This substrate holder assembly is placed within an enclosed container that has a non-abrasive solution therein. The container is mounted to a high speed nutating table that provides random motion to the holder assembly. This action provides isotropic polishing with no polishing created defects on the substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.