Apparatus for cooling circuits
US5040381A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 19, 1990 |
| Grant date | Aug 20, 1991 |
| Priority date | — |
| Expiry date | Apr 19, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An apparatus for cooling circuit modules by use of a thermo-electric device which comprises a series of semiconductor regions and etched copper conductors designed to conduct heat in a specified direction by means of the Peltier Effect. The thermo-electric device is sandwiched between two layers of a polymer based, thermally conductive dielectric such as the dielectric used in the manufacture of Thermal Clad.TM.. The hot layer of Thermal Clad.TM. (i.e., the layer that receives heat) is laminated directly to a heat sink. The cold layer of Thermal Clad.TM. is laminated directly to a cold plate which is, in turn, coupled to the circuit module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.