Method for the preparation of a hot-melt adhesive interconnector
US5041183A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 1990 |
| Grant date | Aug 20, 1991 |
| Priority date | — |
| Expiry date | Jan 9, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1075
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The inventive interconnector, which is used for electrically connecting two arrays of electrodes on two circuit boards, etc., is a striped sheet composed of alternately arranged strips of an insulating adhesive hot-melt resin and strips of a conductive adhesive hot-melt resin composition. The interconnector is prepared by stacking a film of the insulating resin coated on one surface with the conductive composition, integrating the stack into an integral block and slicing the block in a plane perpendicular to the surface of the stacked films. Alternatively, the interconnector is composed of a matrix of an insulating adhesive hot-melt resin and regularly distributed spots of a conductive adhesive hot-melt resin composition. Such an interconnector can be prepared by stacking alternately numbers of the above mentioned striped sheets and sheets of the insulating adhesive hot-melt resin one on the other, integrating the stack into an integral block and slicing the block in a plane perpendicular to the running direction of the conductive strips in the conductive sheets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.