Aluminum electroplating method
US5041194A · kind A · utility
32Cited by
5References
11Claims
0Family size
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Inventors
Key dates
| Filing date | May 15, 1990 |
| Grant date | Aug 20, 1991 |
| Priority date | — |
| Expiry date | May 15, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is disclosed an aluminum electroplating method, which compriss using a low melting composition comprising a mixture of 20 to 80 mole % of an aluminum halide and 80 to 20 mole % of an onium halide of a nitrogen-containing compound selected from the group consisting of bicyclic quaternary amidinium halides, 1-alkylaminopyridinium halides, trialkylimidazolium halides, benzimidazolium halides, alicyclic quaternary ammonium halides and asymmetric tetraalkylammonium halides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.