Thermal head
US5041847A · kind A · utility
6Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 1990 |
| Grant date | Aug 20, 1991 |
| Priority date | — |
| Expiry date | Aug 21, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/3357
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal head comprising a substrate, a heat-resistant dielectric resin layer disposed on the substrate, a resistor layer disposed on the resin layer for forming a plurality of heating elements and an electrode layer disposed on the resistor layer for forming electrodes connecting to the heating elements. A protection film covers an end of the substrate and each end of the layers which is substantially in the same plane as the substrate end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.