Conductive adhesive useful for bonding a semiconductor die to a conductive support base
US5043102A · kind A · utility
34Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 1989 |
| Grant date | Aug 27, 1991 |
| Priority date | — |
| Expiry date | Nov 29, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A conductive die attach composition containing no solvent and substantially no ionic impurities which comprises: PA1 (a) an epoxy resin system comprising (i) at least one low viscosity epoxy resin; and (ii) at least one epoxy resin hardener; PA1 (b) at least one unsaturated monomer which, when polymerized, is not capable of reacting with said epoxy resin system; PA1 (c) at least one free radical initiator for polymericing said unsaturated monomer; and PA1 (d) finely divided silver particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.