Method of forming electrically conducting layer
US5043184A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1989 |
| Grant date | Aug 27, 1991 |
| Priority date | — |
| Expiry date | Dec 27, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4661
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conducting layer such as an additional wiring pattern or an electromagnetic insulation layer is formed on a conducting surface such as of a printed circuit board with an insulating layer being interposed therebetween, by a method which includes the steps of: PA0 (a) providing a liquid thermosetting composition containing an epoxy resin, a curing agent, a polymerizable compound having at least two acrylate or methacrylate groups and a photopolymerization initiator; PA0 (b) applying the composition to the conducting surface to form a coated layer; PA0 (c) irradiating actinic light on the coated layer to polymerize the polymerizable compound and to obtain a solid, thermosetting layer, PA0 (d) heating the thermosetting layer to cure the epoxy resin and to form the insulating layer; and PA0 (e) forming an electrically conducting layer on the cured resin layer. Steps (b) and (c) are repeated until the solid thermosetting layer has a desired thickness. Step (d) may be performed before or after step (e).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.