Method of forming a patterned aluminum layer and article
US5043201A · kind A · utility
32Cited by
3References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 3, 1989 |
| Grant date | Aug 27, 1991 |
| Priority date | — |
| Expiry date | Apr 3, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process is described for the microdemetalization of an aluminized mylar film, the steps including the printing of a micropattern of a caustic resistant, U.V. curable resin on the aluminum surface, etching of the exposed aluminum with a warm saturated caustic solution, followed immediately by rinsing the patterned surface with an acidic solution to neutralize the caustic and stop the etching. Micropatterns having line widths as small as 0.2 mils may be formed by the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.