Epoxy resin composition and a resin-sealed semiconductor device
US5043211A · kind A · utility
21Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1988 |
| Grant date | Aug 27, 1991 |
| Priority date | — |
| Expiry date | Mar 30, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition useful for sealing a semiconductor device includes 100 parts by weight of epoxy resin, 30-75 parts by weight of phenolic resin, 320-570 parts by weight of silica powder, and 2-30 parts by weight of styrene-butadiene-methyl methacrylate copolymer. The surface of the silica powder is treated, at room temperature, by 0.05-1.00% by weight of silane coupling agent, 0.05-1.00% by weight of a silicone base surface active agent, and 0.15-3.00% by weight of thermosetting silicone rubber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.