Method of manufacturing LED rows using a temporary rigid auxiliary carrier

US5043296A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Hans-Jurgen Hacke · Birkenfeld, DE
• Manfred Maier · Lutherstadt Eisleben, DE
• Gregor Unger · Germering, DE
• Oscar Wirbser · Germering, DE

Key dates

• Filing date: Apr 2, 1990
• Grant date: Aug 27, 1991
• Expiry date: Apr 2, 2010

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0364
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An assembly process for strip-shaped LED chips (112) in a row on a solid metal carrier (M) is to be specified. The observation of strictest tolerances in all three directions, i.e. in view of division spacing, trueness to line and surface planarity, is thereby required. On the other hand, an optimum thermal coupling to the metal carrier (M) is required for the illumination of the high dissipated heat from the LEDs (113) of a LED chip (112). The LED chips (112) are applied on to the metal carrier (M) in a transfer process. To that end, the LEDs have their faces glued onto an auxiliary carrier (H1) positioned with high precision and the LED row (114) prefabricated in this fashion is then soldered onto the previously solder-coated metal carrier (M). The auxiliary carrier (H1) is subsequently removed.