Marking techniques for identifying integrated circuit parts at the time of testing
US5043657A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1990 |
| Grant date | Aug 27, 1991 |
| Priority date | — |
| Expiry date | Jul 13, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique for "marking" integrated-circuit (IC) chips so that, when large lots of the chips are drift-tested at different temperatues, each chip can be identified positively so as to be associated with the test data accumulated for the particular chip. The technique includes forming additional resistors on each IC chip with the resistors connected in series and to a voltage supply. The resistors are timmed at the wafer stage to produce at nodal points between the resistors voltages having magnitudes which uniquely identify each particular chip, thereby to permit part-identified tests to be performed after the chips have been packaged as parts ready for shipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.