Housing assembly for miniature electronic device
US5043695A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1990 |
| Grant date | Aug 27, 1991 |
| Priority date | — |
| Expiry date | Jun 15, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49082
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A miniature electronic device includes a housing attached to a substrate by a plurality of terminal leads, each of which has a first end embedded or molded into the housing near the top surface thereof, and a second end bent around a side wall of the housing to engage the bottom surface of the substrate. The bottom surface of the substrate has a plurality of metallized areas, each of which is electrically connected to a component on the upper surface of the substrate. The second end of each lead is soldered or welded to a metallized area. The connection of the leads to the metallized areas secures the housing to the substrate, with the leads also providing the structure for the electrical and mechanical connection of the substrate (and the components thereon) to a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.