Synthetic resin molding apparatus
US5044919A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1989 |
| Grant date | Sep 3, 1991 |
| Priority date | — |
| Expiry date | Dec 5, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3008
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus for molding a product such as an automotive instrument panel of synthetic resin has a first station including a mechanism for opening and closing a mold assembly, a second station including a mechanism for pouring a resin solution into the mold assembly which is closed, and a third station for hardening the poured resin solution in the mold assembly. A feed mechanism interconnects the first, second, and third stations in a looped configuration for circulating at least three mold assemblies through the first, second, and third stations. The mold assembly includes a first mold die for placing therein a covering sheet of a predetermined shape, a second mold die combinable with the first mold die to define a mold cavity therebetween, and a mechanism for pouring a resin foam solution into the mold cavity to form a molding integral with the covering sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.