Method of making solderable printed circuits formed without plating
US5045141A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1988 |
| Grant date | Sep 3, 1991 |
| Priority date | — |
| Expiry date | Jul 1, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Described herein is a composite structure comprising a dielectric substrate surface with an electrically conductive layer or pathway thereon. The pathway comprises a thermoset resin and sufficient electrically conductive metal, in the configuration of an electric circuit element, to provide desired properties and direct solderability. Direct solderability is achieved without plating the electric circuit element. It has a low surface resistivity, preferably less than 10 m ohm per square. Also described are conductive, thixotropic inks for printed circuit devices which include silver powder and silver flake in its composition. A thixotropic adhesive for bonding the electric circuit element to the dielectric substrate surface is also taught. A method for making the composite structure is further disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.