Micromachined bonding surfaces and method of forming the same
US5045151A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 17, 1989 |
| Grant date | Sep 3, 1991 |
| Priority date | — |
| Expiry date | Oct 17, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of encapsulating a lead bonding pad region of an integrated circuit (such as a sensor used in an implantable medical device) is disclosed. The excapsulant (such as Teflon.TM.-TFE) is mechanically gripped on the surface of the circuit by anchor interlock portions which are held in undercut grooves, micromachined, in a predefined pattern, in the circuit substrate. The encapsulant is held down by the portions in the grooves, forms a tight mechanical seal with the substrate surface and with the insulation around an attached lead, and blocks intrusion of contaminants along the surfaces between these materials or through the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.