Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board
US5045381A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 27, 1989 |
| Grant date | Sep 3, 1991 |
| Priority date | — |
| Expiry date | Sep 27, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting resin composition which comprises a cyanate compound or an isocyanate compound represented by the following general formula (I): EQU A--R.sub.1 --A (I) wherein R.sub.1 is an aromatic group, an alicyclic group or a mixed group thereof and A is a cyanate group or an isocyanate group, and a poly-(p-hydroxystyrene) derivative represented by the following general formula (II): ##STR1## wherein X is a fluorine atom, a bromine atom and a chlorine atom, R.sub.2 is an alkenyl group and an unsaturated carboxyl group, each having 2 to 4 carbon atoms, B is any one of a polymerization initiator residue, a polymerization-terminating agent residue, H and ##STR2## m is an integer of 1 to 4 and n is an integer of 5 to 100, and further containing a compound having at least one N-substituted unsaturated imido group, if required, can produce a printed circuit board of high flame retardness, low dielectric constant, low moisture absorption and a high mechanical strength at an elevated temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.