Alloy compositions
US5045411A · kind A · utility
13Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 1990 |
| Grant date | Sep 3, 1991 |
| Priority date | — |
| Expiry date | Jan 10, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12889
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A gold based alloy containing gold, silver, copper, zinc, silicon, iron, boron, nickel and indium for the manufacture of gold articles is described which has a lower melting point, extended remelting capabilities, high resistance to cracking, improved color consistency and increased ductility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.