Toughened, high temperature resin matrix system
US5045609A · kind A · utility
7Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1989 |
| Grant date | Sep 3, 1991 |
| Priority date | — |
| Expiry date | Jul 7, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A matrix resin system, for the preparation of composite parts, is comprised of a major amount of cyanate resin and an epoxy resin modified by reaction with an isocyanate. The resin system can be toughened by the addition of thermoplastic material, the toughness improvement being enhanced by the addition of a polyester rubber additive. The modified epoxy resin system is itself a resin having good modulus and Tg characteristics. The resin is cured at temperatures of 250.degree.-400.degree. F. in the presence of a metallic complex catalyst, and OH donor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.