Installation structure of integrated circuit devices
US5045922A · kind A · utility
36Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1990 |
| Grant date | Sep 3, 1991 |
| Priority date | — |
| Expiry date | Sep 17, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An installation structure of integrated circuit devices, in which two or more types of integrated circuit devices of different base materials are installed onto the same installation substrate. Since the installation structure has a construction according to different characteristics such as a thermal conductivity, heat generation amount, thermal expansion coefficient and the like of the integrated circuit devices made of different materials, the reliability of each device and its connection and the reduction of the costs required for the cooling method can be presented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.