Method of fabricating ceramic electronic component of multilayered type
US5046236A · kind A · utility
15Cited by
5References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 10, 1990 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | Oct 10, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49082
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of fabricating an electronic component of multilayered type comprising the steps of sequentially forming and laminating a plurality of metal films respectively having different metal compositions for constituting the alloy composition of an inner electrode by the thin film forming process to obtain a laminated metal film, laminating a plurality of ceramic green sheets through laminated metal films such that the laminated metal film is arranged between the ceramic green sheets, sintering a laminated body thus obtained and alloying the laminated metal films to form a plurality of inner electrodes each composed of an alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.