Composite stencil for screen printing
US5046415A · kind A · utility
29Cited by
6References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 4, 1991 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | Feb 4, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/1225
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composite stencil for screen printing solder paste includes a layer of metalic material such as brass and a layer of flexible material bonded to the metalic layer. The metalic layer has a thickness of 0.002 to 0.010 inches, while the flexible layer is 0.002 to 0.010 inches thick. The combined thickness of the composite stencil is approximately 0.008 to 0.012 inches. The stencil can be manufactured by forming openings in the metalic sheet and then applying a layer of photosensitive flexible material to the metalic sheet. The metalic sheet is then used as a stencil to expose the photosensitive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.