Method and apparatus for soldering articles
US5046658A · kind A · utility
8Cited by
7References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 27, 1989 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | Jul 27, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A technique is disclosed for achieving reduced residues on a circuit board (10) following soldering of each conductive member (18) of a component (20) to each corresponding metallized area (12) on the board. At the outset, a layer (22) of low solids solder paste is applied to the metallized areas (12) on the board. Thereafter, an acid is applied to the paste layers (22). Finally, the low solids paste is reflowed while the circuit board (10) is immersed in the inert atmosphere to bond the conductive members (18) of the component (20) to the metallized areas (12) on the circuit board (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.