Method and apparatus for mounting an integrated circuit on a printed circuit board
US5046953A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 1990 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | May 25, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for creating an electrical connection between a tape-assisted bonding (TAB) segment having a plurality of conductive leads formed thereon and a printed circuit board also having a plurality of conductive leads formed thereon. A sheet of polymeric material having conductive elements mounted thereon so that each element protrudes from both sides of the sheet is disposed between a plurality of TAB segment leads and a corresponding plurality of generally opposing printed circuit board leads. A clamp secures the TAB segment to the printed circuit board thereby sandwiching the conductive elements between the TAB segment leads and the printed circuit board leads thus creating electrical connections between the opposing leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.