Process for the production of metal clad thermoplastic base materials and printed circuits on thermoplastic base materials
US5047114A · kind A · utility
15Cited by
12References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 1989 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | Feb 21, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for bonding metal directly to thermoplastic polymeric base materials and a process for producing printed circuits from such metal clad thermoplastic polymeric base materials are provided. The invention also includes the articles so produced. Metal clad thermoplastic polymeric base materials are produced by laminating a metal foil or sheet to thermoplastic polymeric base material, under pressure, at a temperature from about 2.degree. C. to about 45.degree. C. above the glass transition temperature (Tg) of the thermoplastic. The polymeric material is free of volatile materials such as moisture or solvents when laminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.