High density corrugated wafer board panel product
US5047280A · kind A · utility
21Cited by
7References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 3, 1989 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | Jan 3, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/662
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A `high density` corrugated wafer board panel is provided. The wafer board panel has a substantially uniform density ranging from between about 700 kg/m.sup.3 to 900 kg/m.sup.3. As a result of increasing the density of the panel without changing the panel weight per projected unit area, a panel having improved overall flexure performance properties is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.