Method of manufacturing a thick-film circuit arrangement
US5047368A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1989 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | Apr 3, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method of forming a thick-film circuit arrangement having an electronic circuit which is constructed on a surface (17) of a ceramic substrate plate (3) and which consists of conductor paths (5), resistors, capacitors and components, in particular integrated switching circuits without a housing, formed according to thick-film technique, in this structure has between the electrically conductive structures (5) a sintered, non-conductive paste substantially filling the intermediate spaces between them and both the structures and the interposed pastes are covered by a sintered insulating paste. For concealing the thick-film circuit arrangement from unauthorized access, the following covering construction is carried out: PA0 1. the paste in the intermediate spaces fills the same between the electronically active thick-film conductor structures in such a manner that the tops of the electrically active structures and the insulating filling layer (7) formed from an insulating paste and filling the intermediate spaces between them are situated substantially in one plane, and PA0 the insulating paste is provided over the combined conductor/filling layer (11) in a co…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.