Sputtering method
US5047394A · kind A · utility
2Cited by
5References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1989 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | Sep 12, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/816
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Combination of a flattened cathode in a cylindrical magnetron sputtering system and positioning of a substrate relatively close to the flattened cathode allows deposition of a uniform film having good composition. The system and method of the present invention is especially suitable for depositing films using YBCO and BCSCO targets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.