Process for preparing moldings by compacting and simultaneously bonding fibrous material
US5047453A · kind A · utility
4Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 1985 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | May 3, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/935
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Fibrous material, in particular shoddy from synthetic fiber wastes, can be compacted into thermally and acoustically insulating boards and moldings by mixing with a pulverulent adhesive comprising a hot-melt adhesive and a solid epoxy resin/curing agent system and heating the mixture under pressure in a mold to a temperature at which the hot-melt adhesive becomes liquid and the epoxy resin reacts with its curing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.