Patent · US Expired

Thickened molding compositions

US5047455A · kind A · utility

17Cited by
7References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 15, 1988
Grant dateSep 10, 1991
Priority date
Expiry dateSep 15, 2008

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L75/02
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A thickened, uncrosslinked molding composition which has a long shelf life and can be cured above 50.degree. C. comprises a liquid reactive system, a thickener, a polymerization initiator and conventional additives. The thickener is a combination of a primary aromatic amine and an isocyanate. The molding compositions, which are, in particular, SMCs or BMCs, can be processed into moldings by compression molding, injection molding or transfer molding and subsequent curing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.