Thickened molding compositions
US5047455A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1988 |
| Grant date | Sep 10, 1991 |
| Priority date | — |
| Expiry date | Sep 15, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L75/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thickened, uncrosslinked molding composition which has a long shelf life and can be cured above 50.degree. C. comprises a liquid reactive system, a thickener, a polymerization initiator and conventional additives. The thickener is a combination of a primary aromatic amine and an isocyanate. The molding compositions, which are, in particular, SMCs or BMCs, can be processed into moldings by compression molding, injection molding or transfer molding and subsequent curing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.