Method for making thick film circuit housing assembly design
US5048181A · kind A · utility
7Cited by
7References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 19, 1990 |
| Grant date | Sep 17, 1991 |
| Priority date | — |
| Expiry date | Nov 19, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A housing and a pressure seal structure for use with a thick film circuit having a pressure sensor and terminals includes a base plate below the thick film circuit, a top housing above the thick film circuit covering the pressure sensor and an intermediate rubber ring between the housing and the thick film circuit. A coupling force is applied between the base plate and the top housing to draw the two together and apply a sealing force to the rubber ring and establish a pressure seal at the rubber ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.