Water-soluble, film-forming inorganic compounds, fireproof and fire-resistant composites and fire-resistant, flexible, sheet composite covering materials formed by the use of the compounds, and process for preparing fire-resistant coverings
US5049316A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 1989 |
| Grant date | Sep 17, 1991 |
| Priority date | — |
| Expiry date | Jun 12, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2111/50
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.