Post-press heat treatment process for improving the dimensional stability of a waferboard panel
US5049334A · kind A · utility
47Cited by
2References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 25, 1990 |
| Grant date | Sep 17, 1991 |
| Priority date | — |
| Expiry date | Sep 25, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB27N7/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is provided a process for improving the thickness swelling properties of a manufactured waferboard panel. The process is based on the discovery that a correlative relationship exists between the relative thickness swelling properties versus the parametric properties of time and temperature. Thus the process involves subjecting the manufactured board to a post-heat treatment at a predetermined temperature for a predetermined time in order to obtain the desired percentage reduction in thickness swelling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.