Method and apparatus for applying ultra-thin coatings to a substrate
US5049404A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 1988 |
| Grant date | Sep 17, 1991 |
| Priority date | — |
| Expiry date | Dec 9, 2008 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05B17/0607
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An electrostatic coating method and apparatus are provided that are capable of applying an extremely thin and virtually constant thickness coating to a substrate, and includes a coating applicator having an opening formed of dielectric material through which coating material flows for coating purposes. The coating material supplied to the applicator is pressurized to maintain a substantially constant volume of coating material at the applicator opening output and is vibrated in the vicinity of the applicator opening to provide a uniform flow of coating material to the applicator output, to stabilize the shape of the coating material at the applicator output and to preclude changes in coating material flow rate caused by electrostatic field induced coating material dryout. An electrostatic field of predetemined magnitude is established between the coating material surface and the adjacent substrate to thereby extract minute, uniform size particles from coating material at the applicator opening and subsequently deposit an ultra-thin layer of these particles on the adjacent substrate as the substrate moves past the applicator opening. In dielectric substrate coating applications wher…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.