Method for surface treating thixotropic agents and the resultant low moisture thixotrope
US5049532A · kind A · utility
4Cited by
5References
9Claims
0Family size
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Key dates
| Filing date | Mar 5, 1990 |
| Grant date | Sep 17, 1991 |
| Priority date | — |
| Expiry date | Mar 5, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B33/30
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for producing an attapulgite clay which retains its thixotropic properties, but does not release gases upon being compounded and cured in organic binder systems, such as plastisol, and the resultant low moisture thixotrope. The method involves (1) reducing the moisture content of the attapulgite by heating it under vacuum at an elevated temperature, preferably between 100.degree. C. and 300.degree. C., or (2) reducing the moisture content of the attapulgite by heating it at an elevated temperature, preferably between 100.degree. C. and 350.degree. C., and adding a silicone fluid, to preserve its thixotropic properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.