Unsaturated group-containing polycarboxlic acid resin, resin composition and solder resist resin composition comprising the same and cured product thereof
US5049628A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1989 |
| Grant date | Sep 17, 1991 |
| Priority date | — |
| Expiry date | Sep 27, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/285
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to an unsaturated group-containing polycarboxylic acid resin produced by reacting an epoxidized compound of a condensate of a phenolic compound and an aromatic aldehyde having a phenolic hydroxyl group with (meth)acrylic acid, and further reacting the reaction product with polybasic carboxylic acid or an anhydride thereof; a composition comprising the resin and a cured product of the resin or the composition. The composition according to the present invention is developable with an aqueous alkaline solution and suitable for a solder resist composition which is excellent in heat resistance, solvent resistance, adhesion, electric insulation property and storage stability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.