Ring-alkylated m-phenylene diamine blends for use in curing epoxy resins
US5049639A · kind A · utility
2Cited by
7References
3Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 23, 1989 |
| Grant date | Sep 17, 1991 |
| Priority date | — |
| Expiry date | Feb 23, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/5033
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Blends of diaminoisopropylbenzene (DAIPB) and diaminoethylbenzene (DAEB) are provided for curing epoxy resins. The cured epoxy resins have increased tensile strength and slightly lower glass transistion temperatures as compared with resins cured with either diamine alone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.