Electronic circuit device and method of manufacturing same
US5049980A · kind A · utility
43Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1988 |
| Grant date | Sep 17, 1991 |
| Priority date | — |
| Expiry date | Apr 14, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Plural semiconductor elements are buried into an insulating substrate, and top surfaces of semiconductor elements and the substrate are in a same plane. A photosensitive dry film is covered on surfaces of the substrate and semiconductor elements. The photosensitive dry film has openings corresponding to electrodes of semiconductor elements, and conductors are filled in openings of the photosensitive dry film. The device has the multi-layer wiring construction without damaging to semiconductor elements arranged on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.