Liquid-cooling module system for electronic circuit components
US5050037A · kind A · utility
48Cited by
7References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1988 |
| Grant date | Sep 17, 1991 |
| Priority date | — |
| Expiry date | Sep 29, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly having a printed circuit board mounted, on both faces, heat generative electronic circuit components, such as integrated circuit chips, and a pair of liquid-cooling modules arranged on both sides of the printed circuit board. Each of the liquid-cooling modules is provided with a liquid cooling plate having liquid coolant supply heads and a plurality of resilient heat transfer units held by the liquid-cooling plate and arranged in compressive contact with the electronic circuit components on both faces of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.