Composite material, a heat-dissipating member using the material in a circuit system, the circuit system
US5050040A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 1990 |
| Grant date | Sep 17, 1991 |
| Priority date | — |
| Expiry date | May 7, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12486
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A novel composite metal material comprises a ferrous metal of relatively low thermal expansion properties and a silver metal substantially free of ferrous constituents having a relatively high thermal conductivity which cooperate in a novel way to provide the composite material with an effective thermal expansion coefficient corresponding to that of various silicon or gallium arsenide semiconductor devices and the like for reliably mounting the devices while also providing paths of high conductivity silver metal extending through the composite material to provide improved heat-dissipation from the semiconductor devices. A circuit system mounts a semiconductor device using the novel composite metal material alone, bonded to other support materials, or formed into a selected shape. In one preferred embodiment, the composite material is used in a novel heat-dissipating member having components of different shape which are bonded together. One component formed of the novel composite material has a selected shape for compactly mounting the semiconductor device and the second component is formed of high thermal conductivity metal and has a different shape particularly adapted to receive …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.