Multilayer through hole connections
US5050295A · kind A · utility
21Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1990 |
| Grant date | Sep 24, 1991 |
| Priority date | — |
| Expiry date | Oct 12, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of providing a through-hole connection between conductive layers of a multilayer circuit board assembly whose thickness is liable to expansion and contraction is described. The method includes inserting into through-holes in adjacent boards a tubular flexible conductive member and expanding that member in a position intermediate its ends to engage the through-holes. The boards are then urged together to further expand the tubular member so as to retain that member in the through-holes. Typically the conductive member comprises a tubular braid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.